Electronic Manufacturing Services (EMS)

With modern MIMOT placement machines we realize PCB assembly in surface mount technology efficiently from a componend size of 0402 und boards up to 440 x 300 mm with a maximum capacity of 9,000 placements per hour.

For our SMD production we apply vapor phase soldering (condensation soldering), thus ensuring a 100% protected atmosphere during the vapor phase. Overheating is excluded as the temperature for lead-containing products is at maximum of 200° C, and for lead-free products at 230°C.

Quality assurance is carried out by high-performance AOI systems from Orbotech.

In the field of information electronics, wired components are largely replaced by SMD components. Many products still comprise partially or entirely conventrional wired components. The assembly of such components  (through-hole technology) is carried out on Laserlite placement tables. Quality is always the top priority for our trained staff. The components are then connected with the circuit board on our selective soldering machine (SEHO) with highest precision.

Due to the highly diverse applications electronic assemblies are increasingly faced with extreme environmental conditions. At the same time, integration density increases. Nevertheless, in order to ensure a proper functionality of the modules, the coating with a protective- or EMC-varnish is often required. In many cases due to the strict explosion protection regulations or due to use under harsh environmental conditions, the assembly encapsulation is often essential to ensure robustness. For this step, we have a completely vented varnish plant as well as the corresponding technical equipment.

In addition to conventional printed board assembly, it is possible to connect devices such as connectors with the circuit board via the press-in technology. By pressing multi-pin connectors an additional attachment (screws, rivets, etc.) have become unnecessary, specifically for areas such as backplanes, back panels, and motherboards.

The advantages of the press-in technology are: no thermal load, no solder bridges, no flux residues and reparability. Of course, we dispose over the respective equipped for these additional work steps.

From design to PCB assembly to complete assembly – we offer you everything from a single source. In addition to our Electronic Manufacturing Services, we also offer installation of electronic assemblies in casings and all other assembly work. We work on the in-house built assemblies or those provided by third parties and provide these in the required casings.

We are happy to build your complete product until placing into operation and customer-specific final testing.